IC Packaging Technology Expo

Venue: Tokyo International Exhibition Center (Tokyo Big Sight)
Country: Tokyo, Japan
Start Date: 18-JAN-12 End Date: 20-JAN-12
Industry: Packaging

EVENT PROFILE

ICP – IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World’s TOP companies in IC design, assembly and testing services.


VISITOR’S PROFILE

Professionals of semiconductor assembly & electronics manufacturers in fields such as: Production/Manufacturing, Engineering, Jisso, Design, R&D, Quality Control, Purchase etc. are the target visitors.


EXHIBITOR’S PROFILE

Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.


EVENT REVIEWS & EXPERIENCE

IC Packaging Technology Expo-[2011]
Venue: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
Date: Jan 19, 2011 – Jan 21, 2011
Industry Focus: Packaging


Organizer:

Reed Exhibitions Japan Limited
Addresss:18F Shinjuku – Nomura Building, 1-26-2 Nishishinjuku, Shinjuku -, Tokyo, Japan
Tel:+(81)-(3)-33498501
Fax:+(81)-(3)-33498599


IC Packaging Technology Expo

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