Beijing International Packaging Fair

EVENT PROFILE

CHIPF2010 was strongly supported by many international packaging associations, such as WPO, APF and PPMA. The exhibition covers an area of 60,000 sqm and attracted about 500 enterprises plus tens of thousands of visitors. About 1,000 leaders from competitive packaging corporations attended the exhibition. It can be said that CHIPF2010 had a great impact upon world packaging industry. CHIPF 2012 will choose Better Packaging, More Success as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging safety. In the meanwhile, CHIPF2012 will continue to broaden internationa

VISITOR’S PROFILE

Professionals related to the field of packing equipment and materials, packaging technology, package design, labels, recycling of tare and packing materials are the target visitors.

EXHIBITOR’S PROFILE

Profiles for exhibit includes Packaging material and products: Paper packaging material and products, plastic packaging material and products, metal packaging material and products, composite packaging material and products, auxiliary packaging material, glass packaging products, wooden material packaging and products. Packaging machinery and equipment: Packaging machinery, packaging printing machinery, packaging material and products production line and packaging test equipment. Packaging technology and others: Resources recycling technology and products, packaging high-tech and products, RFID products, packaging printing technology and design, packaging presentation of education and scientific research projects, typical client presentation of packaging products and packaging service products.

EVENT REVIEWS & EXPERIENCE

Beijing International Packaging Fair-[2010]
Venue: China New International Exhibition Center, Beijing, China
Date: Jun 02, 2010 – Jun 04, 2010
Covered Area: 60,000 Square Meter
Industry Focus: Packaging

Organizer:

Beijing International Packaging Fair